Design Characterization of Microwave Antenna BGA Interconnect Structure Using Test-Validated Physics
D.A. Pietila, M. Rassaian, K. Brice-Heames
Researchers evaluated a two-component solder BGA structure for attaching a microwave receiver module to a phased array antenna. They used a plastic-strain damage model and finite element analysis to characterize and improve the solder's fatigue life, finding that reducing the encapsulant's CTE significantly extended its durability.